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Geometry/TrackerCommonData/data/Materials/tob_module.in
1 790 строк
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Giulio Eulisse
Snapshot of CMSSW_6_2_0_pre8.
26 июн 2013, 18:12
26 июн 2013, 18:12
214ab73
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TOB MODULES ============ $$ This includes all the volumes that make up the TOB modules $$ as well as the electronics on the rods ! Input file for mixture.f Start new mixtures with a '#' in the first column Start the components with a '*' in the first column You can type any kind of comment in as long as you don't start it with '#' or '*' ! ..................................................................... For mixture declaration: Name of Mixture, Name of GMIX for title file, Monte Carlo Volume, MC Area For items in a compound: Item number, Comment, Material (has to be written exactly as in material.input file), Volume, Multiplicity, Type Type is one of the following: SUP for support SEN for sensitive volumes CAB for cables COL for cooling ELE for electronics ..................................................................... o Pitch adapter, r-phi -------------------- MCVolume: (8.6 x 1.25 x 0.11) cm^3 (1) Glass pitch adapter material is Schott D263 Borosilicate Glass, density = 2.51 g/cm^3 properties taken from http://www.schott.com/fpd/english/products/fpd/d263t.html and http://www.osti.gov/bridge/servlets/purl/10117627-uo1lPX/webviewable/10117627.pdf (TIB: CORNING 1737F density = 2.54 g/cm^3) Borosilicate Glass chemical composition: http://www.qvf.com/en/Equipment_1/Borosilicate%20glass/Composition.shtml dimensions 9.64 x 1.25 x 0.0550 cm^3 = 0.66275 cm^3 (TIB: 300 um, TID/TOB/TEC: 550 um thickness) [WAS dimensions 9.64 x 1.25 x 0.03 cm^3 = 0.3615 cm^3] (2) Pitch adapter spacers dimensions 86x3x0.635 mm^3 + 60x3x0.635 mm^3 = 278.13 mm^3 = 0.27813 cm^3 [WAS (NOMEX) 0.24 cm^3] [WAS (3) Carbon fibre support piece dimensions 8.6 x 1.18 x 0.06 cm^3] ...................................................................... # "TOB Pitch Adapter r-phi" "TOB_PA_rphi" 1.1825 10.75 * 1 "Glass pitch adapter" "Borosilicate_Glass" 0.66275 1 ELE * 2 "Spacer" "Ceramic" 0.27813 1 SUP ...................................................................... ====================================================================== o Pitch adapter, stereo -------------------- MCVolume: (0.78*8.6*0.11 + 0.5 * 0.863*8.6*0.11) cm^3 = 1.146 cm^3 (1) Glass pitch adapter material is Schott D263 Borosilicate Glass, density = 2.51 g/cm^3 properties taken from http://www.schott.com/fpd/english/products/fpd/d263t.html and http://www.osti.gov/bridge/servlets/purl/10117627-uo1lPX/webviewable/10117627.pdf (TIB: CORNING 1737F density = 2.54 g/cm^3) Borosilicate Glass chemical composition: http://www.qvf.com/en/Equipment_1/Borosilicate%20glass/Composition.shtml dimensions: [ ( 0.9 x 9.6 x 0.0550 ) + 0.5 x ( 0.9 x 9.6 x 0.0550 ) ] cm^3 = 0.7128 cm^3 (TIB: 300 um, TID/TOB/TEC: 550 um thickness) [WAS dimensions 0.9*9.6*0.03 + 0.5 * 0.9*9.6*0.03 = 0.389 cm^3] (2) Pitch adapter spacers dimensions 86x3x0.635 mm^3 + 60x3x0.635 mm^3 = 278.13 mm^3 = 0.27813 cm^3 [WAS (NOMEX) 0.24 cm^3] [WAS (3) Carbon fibre support piece dimensions 8.6 x 1.18 x 0.06 cm^3] [WAS (3) Carbon fibre frame piece 0.8*8.0*1.5*0.06 = 0.576 cm^3 ] ........................................................................ # "TOB Pitch Adapter stereo" "TOB_PA_ster" 1.146 10.42 * 1 "Glass pitch adapter" "Borosilicate_Glass" 0.7128 1 ELE * 2 "Spacer" "Ceramic" 0.27813 1 SUP ........................................................................ ======================================================================== o Module end plate ---------------- Carbon fiber endplate where electronics sits on top MCVolume: (12 x 4.5 x 0.0625) cm^3 (1) CF dimensions from EDM file CMSTKOBM0026 version AA { [ 39 x 119.7] + 2 x [ 6 x 29.9 ] - 2 x [ pi x (8.4 / 2)^2 ] - 2 x [ pi x (3.5 / 2)^2 ] - 4 x [ pi x (1.6 / 2)^2 ] } mm^2 x 0.625 mm = = 4888.98 mm^2 x 0.625 mm = 3055.61 mm^3 [WAS dimensions: 12 x 4.7 x 0.06 cm = 3.384 cm^3] (2) 3D Label Plastic (kapton): m = 0.020 g density = 1.40 g/cm^3 --> volume = 0.0143 cm^3 ................................................................... # "TOB module end plate" "TOB_frame_ele" 3.375 54.0 * 1 "CF plate" "Carbon fibre str." 3.05561 1 SUP * 2 "Module 3D Label" "T_Kapton" 0.0143 1 ELE ................................................................... =================================================================== o Ceramic Hybrid Support [WAS CF Hybrid Support] -------------- MCVolume: (8.6 x 3.71 x 0.0380) cm^3 = 1.2124 cm^3 [WAS MCVolume: 7 x 3.33 x 0.06 = 1.3986 cm^3] (1) Ceramic plate dimensions: [ (37.1-11.8)x72 + 11.8x86] mm^2 x 0.380 mm = = 2836.4 mm^2 x 0.380 mm = 1077.832 mm^3 [WAS (1) CF dimensions: 7 x 3.4 x 0.06 = 1.428 cm^3] .................................................................... # "TOB hybrid support" "TOB_hybrid_supp" 1.3986 23.31 * 1 "Hybrid support" "Ceramic" 1.077832 1 SUP .................................................................... ==================================================================== o Aluminium cooling I ------------------- Al piece at sensor middle This one includes the screw ! MCVolume: (1.6 x 2 x 0.03) cm^3 (1) Al heat spreader dimensions from EDM file CMSTKOBM0025 version 0 { [ 16 x 20 ] - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm = 316.8584 mm^2 x 0.300 mm = 95.0575 mm^3 [WAS 0.096 cm^3] [THIS MATERIAL HAS BEEN CREATED APART (2) CF compensator dimensions from EDM file CMSTKOBM0035 version AA { [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm = = 337.46 mm^2 x 0.300 mm = 101.238 mm^3 [WAS 0.15 cm^3] ] (2-3) Screw: 0.009 cm^3 Stainless Steel, 0.02 cm^3 Al washer ..................................................................... # "TOB Module Cooling 1" "TOB_mod_cool1" 0.096 3.2 * 1 "Al heat spreader" "Aluminium" 0.0950575 1 COL * 2 "Steel screw" "Steel-008" 0.009 1 COL * 3 "Al washer" "Aluminium" 0.02 1 COL ..................................................................... ===================================================================== [WAS o Aluminium cooling II -------------------- Al piece at sensor middle No screw ! MCVolume: (1.5 x 2.8 x 0.03) cm (1) Al heat spreader dimensions from EDM file CMSTKOBM0025 version 0 { [ 16 x 20 ] - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm = 316.8584 mm^2 x 0.300 mm = 95.0575 mm^3 [WAS 0.096 cm^3] [THIS MATERIAL HAS BEEN CREATED APART (2) CF compensator dimensions from EDM file CMSTKOBM0035 version AA { [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm = = 337.46 mm^2 x 0.300 mm = 101.238 mm^3 [WAS 0.15 cm^3] ] .................................................................... # "TOB Module Cooling 2" "TOB_mod_cool2" 0.126 4.2 * 1 "Al heat spreader" "Aluminium" 0.0950575 1 COL .................................................................... ==================================================================== NO MORE NEEDED, ALL THE SPREADER ARE THE SAME ] o Aluminium cooling III [WAS o Aluminium cooling III ] --------------------- Al and locator piece at hybrid sides This one includes the screw ! MCVolume: (1.5 x 2.8 x 0.03) cm^3 (1) Al heat spreader dimensions from EDM file CMSTKOBM0024 version 0 { [ 15 x 28 ] - (8 x 8 / 2) - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm = 384.8584 mm^2 x 0.300 mm = 115.4575 mm^3 [WAS 0.116 cm^3] [THIS MATERIAL HAS BEEN CREATED APART (2) CF compensator dimensions from EDM file CMSTKOBM0035 version AA { [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm = = 337.46 mm^2 x 0.300 mm = 101.238 mm^3 [WAS 0.15 cm^3] ] (2-3) Screw: 0.009 cm^3 Stainless Steel, 0.02 cm^3 Al washer (4) CuBe/brass -> take all Cu for now: (0.0044 * 3) cm^3 ................................................................... # "TOB Module Cooling 2" "TOB_mod_cool2" 0.126 4.2 * 1 "Al heat spreader" "Aluminium" 0.1154575 1 COL * 2 "Steel screw" "Steel-008" 0.009 1 COL * 3 "Al washer" "Aluminium" 0.02 1 COL * 4 "Cu locator" "Copper" 0.0044 3 SUP ................................................................... =================================================================== o Carbon Fibre Compensator (cooling) -------------------- MCVolume: (1.6 x 2.6 x 0.03) cm^3 (1) CF compensator dimensions from EDM file CMSTKOBM0035 version AA { [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm = = 337.46 mm^2 x 0.300 mm = 101.238 mm^3 ............................................................................ # "TOB Module Cooling Compensator" "TOB_mod_comp" 0.1248 4.16 * 1 "CF Compensator" "Carbon fibre str." 0.101238 1 COL ............................................................................ ============================================================================ o Module side rail I rphi (heavier side) --------------------------------------- Volumes from single-sided modules. Also used for double-sided modules MCVolume: (1.7 x 21 x 0.08) cm^3 (1) Carbon fiber leg dimensions from EDM file CMSTKOBM0026 version AA { [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm = = 3666.17 x 0.625 mm^3 = 2291.36 mm^3 [WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3] Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm EDMS Code EP 680-1174-080-A (ss) and EP 680-1174-060-D (ds) (2-3) DS or SS rphi Bias Kapton: m = 0.552 g density = 1.4 g/cm^3 --> volume = 0.394 cm^3 Copper: m = 0.088 g density = 8.96 g/cm^3 --> volume = 0.010 cm^3 (4) HV wire (115 mm) Copper: m = (0.14+0.10) g = 0.24 g density = 8.96 g/cm^3 --> volume = 0.027 cm^3 (5) Transparent Sleeve Polyethylene: m = 0.040 g density = 0.95 g/cm^3 --> volume = 0.042 cm^3 (6) Soldering (Sn/Pb alloy) BGA196 (Ball Grid Array), Sn/Pb/Ag 62/36/2: m = 0.030 g density = 8.82 g/cm^3 --> volume = 0.0034 cm^3 (7) Thermistor Caps Kapton: m = 0.010 g density = 1.4 g/cm^3 --> volume = 0.0071 cm^3 (8) Thermistor Stiffeners FR4: m = 0.040 g density (T_G10) = 1.90 g/cm^3 --> volume = 0.021 cm^3 (9) SMD Capacitors BaTiO3: m = 0.090 g density = 6.02 g/cm^3 --> volume = 0.015 cm^3 (10) SMD Resistors Al2O3: m = 0.050 g density = 3.96525 g/cm^3 --> volume = 0.0126 cm^3 [WAS: (2) Kapton from Bill's table: ~0.5 cm^3 (3) Copper traces Robert: Cu is approx 15 um thick => 0.01 cm^3 (just a guess) (4) Components: Caps: 1 x 1206 3 x 1.5 x 1.5 mm^3 1 x 1210 3.2 x 2.5 x 1.5 mm^3 Rs: 2 x 1206 3 x 0603 1.6 x 0.8 x 0.8 mm (thermistors) ] .......................................................................... # "TOB side rail active rphi" "TOB_sid_rail1" 2.856 35.7 * 1 "CF leg" "Carbon fibre str." 2.29136 1 SUP * 2 "Bias Kapton" "T_Kapton" 0.394 1 ELE * 3 "Bias Copper" "Copper" 0.010 1 ELE * 4 "HV Wire" "Copper" 0.027 1 ELE * 5 "Transparent Sleeve" "Polyethylene" 0.042 1 ELE * 6 "Soldering" "BGA" 0.0034 1 ELE * 7 "Thermistor Caps" "T_Kapton" 0.0071 1 ELE * 8 "Thermistor Stiffeners" "T_G10" 0.021 1 ELE * 9 "Capacitors" "Barium_Titanate" 0.015 1 ELE * 10 "Resistors" "Ceramic" 0.0126 1 ELE .......................................................................... ========================================================================== o Module side rail II rphi (lighter side) ---------------------------------------- Volumes from single-sided modules. Also used for double-sided modules MCVolume: (1.7 x 21 x 0.08) cm^3 (1) Carbon fiber leg dimensions from EDM file CMSTKOBM0026 version AA { [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm = = 3666.17 x 0.625 mm^3 = 2291.36 mm^3 [WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3] Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm EDMS Code EP 680-1174-090-A (ss) and EP 680-1174-050-C (ds) (2-3) DS or SS rphi Insulator Kapton: m = 0.402 g density = 1.4 g/cm^3 --> volume = 0.287 cm^3 Copper: m = 0.041 g density = 8.96 g/cm^3 --> volume = 0.0046 cm^3 [WAS: (2) Kapton from Bill's table: ~0.45 cm^3 (3) Copper: 2 x 20x8 mm^2 x 17 um = 0.00544 cm^3 ] ........................................................................ # "TOB side rail passive rphi" "TOB_sid_rail2" 2.856 35.7 * 1 "CF leg" "Carbon fibre str." 2.29136 1 SUP * 2 "Insulator Kapton" "T_Kapton" 0.287 1 ELE * 3 "Insulator Copper" "Copper" 0.0046 1 ELE ........................................................................ ======================================================================== o Module side rail I stereo (heavier side) --------------------------------------- Volumes from single-sided modules. Also used for double-sided modules MCVolume: (1.7 x 21 x 0.08) cm^3 (1) Carbon fiber leg dimensions from EDM file CMSTKOBM0026 version AA { [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm = = 3666.17 x 0.625 mm^3 = 2291.36 mm^3 [WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3] Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm EDMS Code EP 680-1174-080-A (2-3) DS or SS rphi Bias (different with respect to rphi) Kapton: m = 0.514 g density = 1.4 g/cm^3 --> volume = 0.367 cm^3 Copper: m = 0.088 g density = 8.96 g/cm^3 --> volume = 0.0098 cm^3 (4) HV wire (115 mm) Copper: m = (0.14+0.10) g = 0.24 g density = 8.96 g/cm^3 --> volume = 0.027 cm^3 (5) Transparent Sleeve Polyethylene: m = 0.040 g density = 0.95 g/cm^3 --> volume = 0.042 cm^3 (6) Soldering (Sn/Pb alloy) BGA196 (Ball Grid Array), Sn/Pb/Ag 62/36/2: m = 0.030 g density = 8.82 g/cm^3 --> volume = 0.0034 cm^3 (7) Thermistor Caps Kapton: m = 0.010 g density = 1.4 g/cm^3 --> volume = 0.0071 cm^3 (8) Thermistor Stiffeners FR4: m = 0.040 g density (T_G10) = 1.90 g/cm^3 --> volume = 0.021 cm^3 (9) SMD Capacitors BaTiO3: m = 0.090 g density = 6.02 g/cm^3 --> volume = 0.015 cm^3 (10) SMD Resistors Al2O3: m = 0.050 g density = 3.96525 g/cm^3 --> volume = 0.0126 cm^3 [WAS: (2) Kapton from Bill's table: ~0.5 cm^3 (3) Copper traces Robert: Cu is approx 15 um thick => 0.01 cm^3 (just a guess) (4) Components: Caps: 1 x 1206 3 x 1.5 x 1.5 mm^3 1 x 1210 3.2 x 2.5 x 1.5 mm^3 Rs: 2 x 1206 3 x 0603 1.6 x 0.8 x 0.8 mm (thermistors) ] ........................................................................... # "TOB side rail active stereo" "TOB_sid_rail1st" 2.856 35.7 * 1 "CF leg" "Carbon fibre str." 2.29136 1 SUP * 2 "Bias Kapton" "T_Kapton" 0.367 1 ELE * 3 "Bias Copper" "Copper" 0.0098 1 ELE * 4 "HV Wire" "Copper" 0.027 1 ELE * 5 "Transparent Sleeve" "Polyethylene" 0.042 1 ELE * 6 "Soldering" "BGA" 0.0034 1 ELE * 7 "Thermistor Caps" "T_Kapton" 0.0071 1 ELE * 8 "Thermistor Stiffeners" "T_G10" 0.021 1 ELE * 9 "Capacitors" "Barium_Titanate" 0.015 1 ELE * 10 "Resistors" "Ceramic" 0.0126 1 ELE ........................................................................... =========================================================================== o Module side rail II stereo (lighter side) ---------------------------------------- Volumes from single-sided modules. Also used for double-sided modules MCVolume: (1.7 x 21 x 0.08) cm^3 (1) Carbon fiber leg dimensions from EDM file CMSTKOBM0026 version AA { [ 15.1 x 210 ] + [ 4.0 x 122 ] + 2 x [ 1.5 x 22.5 ] - [ pi x (8.4 / 2)^2 ] - [ pi x ( 2.5 / 2 )^2 ] } mm^2 x 0.625 mm = = 3666.17 x 0.625 mm^3 = 2291.36 mm^3 [WAS 21 x 1.7 x 0.06 cm = 2.14 cm^3] Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm EDMS Code EP 680-1174-100-A (2-3) DS or SS rphi Insulator (different with respect to rphi) Kapton: m = 0.389 g density = 1.4 g/cm^3 --> volume = 0.278 cm^3 Copper: m = 0.041 g density = 8.96 g/cm^3 --> volume = 0.0046 cm^3 [WAS: (2) Kapton from Bill's table: ~0.45 cm^3 (3) Copper: 2 x 20x8 mm^2 x 17 um = 0.00544 cm^3 ] ........................................................................ # "TOB side rail passive rphi" "TOB_sid_rail2st" 2.856 35.7 * 1 "CF leg" "Carbon fibre str." 2.29136 1 SUP * 2 "Insulator Kapton" "T_Kapton" 0.278 1 ELE * 3 "Insulator Copper" "Copper" 0.0046 1 ELE ........................................................................ ======================================================================== o Hybrid for TOB layers 1/2 ------------------------- [WAS o Hybrid for TOB layers 5/6 ------------------------- ] These are the hybrids of the double sided layers. Each of the hybrids carries 4 APVs (changed 15/03/02) Hybrids have 4 APVs MCVolume: (6 x 2.5 x 0.05) cm^3 = 0.75 cm^3 Dimensions (60 x 25) mm^2 = 15 cm^2 (1) Hybrid reviewed November 2006 - Central Hybrid (no kapton tail, which is in ICC* material definition, see below) see http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf - Kapton: (25+25) um = 50 um = 0.0050 cm --> 0.075 cm^3 - Copper: (18+12+18+18+18+12) um = 96 um = 0.0096 cm --> 0.144 cm^3 - Solder Mask: 20 um = 0.0020 cm --> 0.030 cm^3 - Glue: (50+50) um = 100 um thickness = 0.0100 cm --> 0.150 cm^3 [WAS (1) new FR4 hybrid Estimate: 300 mu FR4, 3 x 25 mu Cu ~300 mu Kapton -Pt-Au layer: tbd ] (2) Hybrid components R: (14 + n_APV) 0402 size material: carbon -> 18 C: 2 x 1206 large ones (5 + 2*n_APV) 0402 size -> 13 0402: (1 x 0.5 x 0.5) mm^3 = 0.25 mm^3 = 0.25 x 10^-3 cm^3 1206: (3 x 1.5 x 1.5) mm^3 = 6.75 mm^3 = 6.75 x 10^-3 cm^3 APV25: (7.1 x 8.1 x 0.3) mm^3 = 17.253 mm^3 = 0.017253 cm^3 4 per hybrid REVIEWED November 2006 OK PLL: (4.0 x 4.0 x 0.3) mm^3 = 4.8 mm^3 = 0.0048 cm^3 1 per hybrid REVIEWED November 2006 OK (see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/PauloMoreira/PLL25%20User%20Manua2.1.pdf) MUX: (5.0 x 5.0 x 0.3) mm^3 = 7.5 mm^3 = 0.0075 cm^3 1 per hybrid REVIEWED November 2006 OK (see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/LVDSMUX3_datasheet.pdf) [WAS PLL+MUX : 2.0 x 7.1 x 0.3 mm^3 1 per hybrid ] http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/manuals.htm DCU : (2.0 x 2.0 x 0.3) mm^3 = 1.2 mm^3 = 0.0012 cm^3 1 per hybrid REVIEWED November 2006 OK (see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/Magazzu/DCUF_User_Manual_v3.0.pdf) (3) Wire bonds http://cms.ct.infn.it/bonding/bondspec.htm Al, 1% Si, 25 um diameter, medium hardness tail length visible but short < 50 um 1 wire bond: average of 4 mm length diameter 25 um + 1 tail = = { [ pi x (0.025/2)^2 ] mm^2 x 4 mm } + { [ pi x (0.025/2)^2 ] mm^2 x 0.050 mm } = = [1.963x10^-3 mm^3] + [0.0245x10^-3 mm^3] = 2.0x10^-3 mm^3 = 2.0x10^-6 cm^3 [99% Aluminium + 1% Silicon] PA bias line to sensor bias ring: 5 bonds PA to hybrid: nAPV x 128 bonds PA to sensor: nAPV x 128 bonds TOTAL: 2x128xnAPV+5 bonds = 1029 bonds ...................................................................... # "TOB Hybrid Layer 1/2" "TOB_ele12" 0.75 15.0 Central Hybrid (no tail) * 1 "Central Hybrid Kapton" "T_Kapton" 0.075 1 ELE * 2 "Central Hybrid Copper" "Copper" 0.144 1 ELE * 3 "Central Hybrid Solder Mask" "T_Kapton" 0.030 1 ELE * 4 "Central Hybrid Glue" "Epoxy" 0.150 1 ELE Components: Resistors * 5 "Resistors" "Carbon" 0.25E-3 18 ELE * 6 "R metal" "SMD_metal" 1.E-4 18 ELE Capacitors * 7 "Small caps" "Alumina" 0.25E-3 13 ELE * 8 "C metal" "SMD_metal" 1.E-4 13 ELE * 9 "Large caps" "Alumina" 6.75E-3 2 ELE * 10 "C metal large" "SMD_metal" 1.E-3 2 ELE * 11 "APV25" "Silicon" 0.017253 4 ELE * 12 "PLL" "Silicon" 4.8E-3 1 ELE * 13 "MUX" "Silicon" 7.5E-3 1 ELE * 14 "DCU" "Silicon" 1.2E-3 1 ELE Wire bonds * 15 "Wire bonds" "Aluminium" 1.98E-6 1029 ELE * 16 "Wire bonds" "Silicon" 0.02E-6 1029 ELE ...................................................................... ====================================================================== o Hybrid for TOB layers 3/4 ------------------------- [WAS o Hybrid for TOB layers 7/8 ------------------------- ] Hybrids have 4 APVs as above, except: (2) Hybrid components R: (14 + n_APV) 0402 size material: carbon -> 18 C: 2 x 1206 large ones (5 + 2*n_APV) 0402 size -> 13 (3) Wire bonds see above for details TOTAL: 2x128xnAPV+5 bonds = 1029 bonds ...................................................................... # "TOB Hybrid Layer 3/4" "TOB_ele34" 0.75 15.0 Central Hybrid (no tail) * 1 "Central Hybrid Kapton" "T_Kapton" 0.075 1 ELE * 2 "Central Hybrid Copper" "Copper" 0.144 1 ELE * 3 "Central Hybrid Solder Mask" "T_Kapton" 0.030 1 ELE * 4 "Central Hybrid Glue" "Epoxy" 0.150 1 ELE Components: Resistors * 5 "Resistors" "Carbon" 0.25E-3 18 ELE * 6 "R metal" "SMD_metal" 1.E-4 18 ELE Capacitors * 7 "Small caps" "Alumina" 0.25E-3 13 ELE * 8 "C metal" "SMD_metal" 1.E-4 13 ELE * 9 "Large caps" "Alumina" 6.75E-3 2 ELE * 10 "C metal large" "SMD_metal" 1.E-3 2 ELE * 11 "APV25" "Silicon" 0.017253 4 ELE * 12 "PLL" "Silicon" 4.8E-3 1 ELE * 13 "MUX" "Silicon" 7.5E-3 1 ELE * 14 "DCU" "Silicon" 1.2E-3 1 ELE Wire bonds * 15 "Wire bonds" "Aluminium" 1.98E-6 1029 ELE * 16 "Wire bonds" "Silicon" 0.02E-6 1029 ELE ...................................................................... ====================================================================== o Hybrid for TOB layers 5/6 -------------------------- [WAS Hybrid for TOB layers 9/10 -------------------------- ] Hybrids have 6 APVs as above, except: (2) Hybrid components R: (14 + n_APV) 0402 size material: carbon -> 20 C: 2 x 1206 large ones (5 + 2*n_APV) 0402 size -> 17 (3) Wire bonds see above for details TOTAL: 2x128xnAPV+5 bonds = 1541 bonds ...................................................................... # "TOB Hybrid Layer 5/6" "TOB_ele56" 0.75 15.0 Central Hybrid (no tail) * 1 "Central Hybrid Kapton" "T_Kapton" 0.075 1 ELE * 2 "Central Hybrid Copper" "Copper" 0.144 1 ELE * 3 "Central Hybrid Solder Mask" "T_Kapton" 0.030 1 ELE * 4 "Central Hybrid Glue" "Epoxy" 0.150 1 ELE Components: Resistors * 5 "Resistors" "Carbon" 0.25E-3 20 ELE * 6 "R metal" "SMD_metal" 1.E-4 20 ELE Capacitors * 7 "Small caps" "Alumina" 0.25E-3 17 ELE * 8 "C metal" "SMD_metal" 1.E-4 17 ELE * 9 "Large caps" "Alumina" 6.75E-3 2 ELE * 10 "C metal large" "SMD_metal" 1.E-3 2 ELE * 11 "APV25" "Silicon" 0.017253 6 ELE * 12 "PLL" "Silicon" 4.8E-3 1 ELE * 13 "MUX" "Silicon" 7.5E-3 1 ELE * 14 "DCU" "Silicon" 1.2E-3 1 ELE Wire bonds * 15 "Wire bonds" "Aluminium" 1.98E-6 1541 ELE * 16 "Wire bonds" "Silicon" 0.02E-6 1541 ELE ...................................................................... ====================================================================== o TOB Interface between two sensors and sensor-Pitch Adapter ----------------------------------------------------------- The inactive part between the two sensors and between PA-sensor: Sylgard encapsulant (Silicone) + wire bonds MCVolume: (9.3696 x 0.55 x 0.2) cm^3 = 1.030656 cm^3 (1) Silicone encapsulant http://www.vestaweb.com/silicone/silicone_properties.htm http://www.answers.com/topic/silicone http://www.answers.com/topic/dimethyl-polysiloxane Must weight 0.83 g and dens=0.965 g/cm^3 --> volume = 0.80095 cm^3 (2) Wire bonds see above for details sen-sen bias bonds: 5 bonds TOTAL: 2x128xnAPV+5 bonds = 1029-1541 bonds (average: 1285) ................................................................................ # "TOB Two-Sensor Interface" "TOB_Sens_Interface" 1.030656 7.49568 * 1 "Glue" "Silicone_Gel" 0.80095 1 SUP Wire bonds * 2 "Wire bonds" "Aluminium" 1.98E-6 1285 ELE * 3 "Wire bonds" "Silicon" 0.02E-6 1285 ELE ................................................................................ ================================================================================ o TOB Electronics ICC1/2 Inter Connect Cards ICC1 - serves 1 APV (smaller) ICC2 - serves 2 APVs (bigger) ICC1: MCVolume: (11.800 x 4.400 x 0.250) cm^3 = 12.98 cm^3 ICC2: MCVolume: (11.800 x 6.800 x 0.250) cm^3 = 20.06 cm^3 Data taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/ICCs_MB.htm Layer 1/2 --------- ICC1 ---- Same as Layer 3/4, except: Circuit ICC1 (DS_ICC1) EDMS Code EP 680-1174-200-C (1-2) PCBs FR4: m = 8.179 g density (T_G10) = 1.90 g/cm^3 --> volume = 4.305 cm^3 copper: m = 1.575 g density = 8.96 g/cm^3 --> volume = 0.176 cm^3 (3-4) Connectors NaiS socket + header 2 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S) THIS GOES IN AOH 2 x ICC-AOH 30 pins (AXN330038S + AXN430330S) 2 x ICC-FEH 40 pins (AXN340038S + AXN440330S) 1 x ICC-ICB 50 pins (AXN350038S + AXN450330S) copper: m = 2 x (0.0461 + 0.0515) g + NULL x { 2 x (0.0865 + 0.0965) g } + 2 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 0.9883 g density = 8.96 g/cm^3 --> volume = 0.110 cm^3 resin: m = 2 x (0.0882 + 0.1085) g + NULL x { 2 x (0.1445 + 0.1547) g } + 2 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 1.6589 g density (epoxy) = 1.3 g/cm^3 --> volume = 1.276 cm^3 (5) HV stiffener (2 copies) FR4: m = 0.060 g density (T_G10) = 1.90 g/cm^3 --> volume = 0.032 cm^3 (6) ICC SMD Resistors, 23 x (0603) + 2 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed m = 0.0983 g density = 3.96525 g/cm^3 --> volume = 0.025 cm^3 (7) ICC SMD Capacitors, 10 x (0805) + 6 x (1812), mostly BaTiO3, the total mass is computed m = 1.5300 g density = 6.02 g/cm^3 --> volume = 0.254 cm^3 (8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 2 x ("LVDSBUF" 16 pin) epoxy: m = [ ( 1 x 0.015675 ) + ( 2 x 0.038519 ) ] g = 0.092713 g density = 1.3 g/cm^3 --> volume = 0.071 cm^3 copper: m = [ ( 1 x 0.040 + 2 x 0.076 ) - 0.092713 ] g = 0.099287 g density = 8.96 g/cm^3 --> volume = 0.011 cm^3 (10-13) Hybrid tail (2 copies) (14) HV pin (2 copies) ....................................................................... # "TOB ICC Layer 1/2 (1 APV)" "TOB_L12_ICC1" 12.98 51.92 * 1 "PCB board" "T_G10" 4.305 1 ELE * 2 "PCB copper traces" "Copper" 0.176 1 ELE * 3 "NAiS connectors" "Copper" 0.110 1 ELE * 4 "NAiS connectors" "Epoxy" 1.276 1 ELE * 5 "HV Stiffener" "T_G10" 0.032 2 CAB * 6 "ICC Resistors" "Ceramic" 0.025 1 ELE * 7 "ICC Capacitors" "Barium_Titanate" 0.254 1 ELE * 8 "ICC ASICs EMC" "Epoxy" 0.071 1 ELE * 9 "ICC ASICs copper" "Copper" 0.011 1 ELE * 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 2 ELE * 11 "Hybrid Tail Copper" "Copper" 0.055 2 ELE * 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 2 ELE * 13 "Hybrid Tail Glue" "Epoxy" 0.057 2 ELE * 14 "HV pin (module)" "Brass" 0.011 2 ELE ....................................................................... ======================================================================= ICC2 ---- Same as Layer 3/4, except: Circuit ICC2 (DS_ICC2) EDMS Code EP 680-1174-210-D (1-2) PCBs FR4: m = 12.508 g density (T_G10) = 1.90 g/cm^3 --> volume = 6.583 cm^3 copper: m = 2.452 g density = 8.96 g/cm^3 --> volume = 0.274 cm^3 (3-4) Connectors NaiS socket + header 4 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S) THIS GOES IN AOH 4 x ICC-AOH 30 pins (AXN330038S + AXN430330S) 4 x ICC-FEH 40 pins (AXN340038S + AXN440330S) 1 x ICC-ICB 50 pins (AXN350038S + AXN450330S) copper: m = 4 x (0.0461 + 0.0515) g + NULL x { 4 x (0.0865 + 0.0965) g } + 4 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 1.6715 g density = 8.96 g/cm^3 --> volume = 0.187 cm^3 resin: m = 4 x (0.0882 + 0.1085) g + NULL x { 4 x (0.1445 + 0.1547) g } + 4 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 2.8085 g density (epoxy) = 1.3 g/cm^3 --> volume = 2.160 cm^3 (5) HV stiffener (4 copies) FR4: m = 0.060 g density (T_G10) = 1.90 g/cm^3 --> volume = 0.032 cm^3 (6) ICC SMD Resistors, 46 x (0603) + 4 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed m = 0.1575 g density = 3.96525 g/cm^3 --> volume = 0.040 cm^3 (7) ICC SMD Capacitors, 18 x (0805) + 12 x (1812), mostly BaTiO3, the total mass is computed m = 3.030 g density = 6.02 g/cm^3 --> volume = 0.503 cm^3 (8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 4 x ("LVDSBUF" 16 pin) epoxy: m = ( 1 x 0.015675 + 4 x 0.038519 ) g = 0.169751 g density = 1.3 g/cm^3 --> volume = 0.131 cm^3 copper: m = [ ( 1 x 0.040 + 4 x 0.076 ) - 0.169751 ) g = 0.274249 g density = 8.96 g/cm^3 --> volume = 0.031 cm^3 (10-13) Hybrid tail (4 copies) (14) HV pin (4 copies) ....................................................................... # "TOB ICC Layer 1/2 (2 APVs)" "TOB_L12_ICC2" 20.06 80.24 * 1 "PCB board" "T_G10" 6.583 1 ELE * 2 "PCB copper traces" "Copper" 0.274 1 ELE * 3 "NAiS connectors" "Copper" 0.187 1 ELE * 4 "NAiS connectors" "Epoxy" 2.160 1 ELE * 5 "HV Stiffener" "T_G10" 0.032 4 CAB * 6 "ICC Resistors" "Ceramic" 0.040 1 ELE * 7 "ICC Capacitors" "Barium_Titanate" 0.503 1 ELE * 8 "ICC ASICs EMC" "Epoxy" 0.131 1 ELE * 9 "ICC ASICs copper" "Copper" 0.031 1 ELE * 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 4 ELE * 11 "Hybrid Tail Copper" "Copper" 0.055 4 ELE * 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 4 ELE * 13 "Hybrid Tail Glue" "Epoxy" 0.057 4 ELE * 14 "HV pin (module)" "Brass" 0.011 4 ELE ....................................................................... ======================================================================= Layer 3/4 --------- ICC1 ---- Circuit ICC3 (SS_ICC1) EDMS Code EP 680-1174-220-B MCVolume: ( 11.8 x 4.4 x 0.25 ) cm^3 = 12.98 cm^3 (1-2) PCBs FR4: m = 5.754 g density (T_G10) = 1.90 g/cm^3 --> volume = 3.028 cm^3 copper: m = 1.289 g density = 8.96 g/cm^3 --> volume = 0.144 cm^3 (3-4) Connectors NaiS socket + header 1 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S) THIS GOES IN AOH 1 x ICC-AOH 30 pins (AXN330038S + AXN430330S) 1 x ICC-FEH 40 pins (AXN340038S + AXN440330S) 1 x ICC-ICB 50 pins (AXN350038S + AXN450330S) copper: m = 1 x (0.0461 + 0.0515) g + NULL x { 1 x (0.0865 + 0.0965) g } + 1 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 0.6467 g density = 8.96 g/cm^3 --> volume = 0.0722 cm^3 resin: m = 1 x (0.0882 + 0.1085) g + NULL x { 1 x (0.1445 + 0.1547) g } + 1 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 1.0841 g density (epoxy) = 1.3 g/cm^3 --> volume = 0.834 cm^3 (5) HV stiffener FR4: m = 0.060 g density (T_G10) = 1.90 g/cm^3 --> volume = 0.032 cm^3 (6) ICC SMD Resistors, 14 x (0603) + 1 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed m = 0.0741 g density = 3.96525 g/cm^3 --> volume = 0.019 cm^3 (7) ICC SMD Capacitors, 7 x (0805) + 4 x (1812), mostly BaTiO3, the total mass is computed m = 1.025 g density = 6.02 g/cm^3 --> volume = 0.170 cm^3 (8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 1 x ("LVDSBUF" 16 pin) epoxy: m = [ ( 1 x 0.015675 ) + ( 1 x 0.038519 ) ] g = 0.054194 g density = 1.3 g/cm^3 --> volume = 0.042 cm^3 copper: m = [ ( 1 x 0.040 + 1 x 0.076 ) - 0.054194 ] g = 0.061806 g density = 8.96 g/cm^3 --> volume = 0.007 cm^3 (10-13) Hybrid tail see http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf surface: (19 x 30) mm^2 = 570 mm^2 = 5.70 cm^2 - Kapton: (25+25) um = 50 um = 0.0050 cm --> 0.0285 cm^3 - Copper: (18+12+18+18+18+12) um = 96 um = 0.0096 cm --> 0.05472 cm^3 - Solder Mask: 20 um = 0.0020 cm --> 0.0114 cm^3 - Glue: (50+50) um = 100 um thickness = 0.0100 cm --> 0.057 cm^3 (14) HV pin module side: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm m = 0.04 g per module ICB side: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/ICB_MB.htm m = 0.330 g (6 HV wires) --> 0.330 g / 6 = 0.055 g per module HV pin (brass CuZn36Pb3 Sn plated): m = ( 0.04 + 0.055 ) g = 0.095 g density (brass) = 8.5 g/cm^3 --> volume = 0.011 cm^3 ....................................................................... # "TOB ICC Layer 3/4 (1 APV)" "TOB_L34_ICC1" 12.98 51.92 * 1 "PCB board" "T_G10" 3.028 1 ELE * 2 "PCB copper traces" "Copper" 0.144 1 ELE * 3 "NAiS connectors" "Copper" 0.0722 1 ELE * 4 "NAiS connectors" "Epoxy" 0.834 1 ELE * 5 "HV Stiffener" "T_G10" 0.032 1 CAB * 6 "ICC Resistors" "Ceramic" 0.019 1 ELE * 7 "ICC Capacitors" "Barium_Titanate" 0.170 1 ELE * 8 "ICC ASICs EMC" "Epoxy" 0.042 1 ELE * 9 "ICC ASICs copper" "Copper" 0.007 1 ELE * 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 1 ELE * 11 "Hybrid Tail Copper" "Copper" 0.055 1 ELE * 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 1 ELE * 13 "Hybrid Tail Glue" "Epoxy" 0.057 1 ELE * 14 "HV pin (module)" "Brass" 0.011 1 ELE ....................................................................... ======================================================================= ICC2 ---- Circuit ICC4 (SS_ICC2) EDMS Code EP 680-1174-230-B MCVolume: ( 11.8 x 6.8 x 0.25 ) cm^3 = 20.06 cm^3 (1-2) PCBs FR4: m = 8.175 g density (T_G10) = 1.90 g/cm^3 --> volume = 4.302 cm^3 copper: m = 1.617 g density = 8.96 g/cm^3 --> volume = 0.180 cm^3 (3-4) Connectors NaiS socket + header 2 x ICC-Kapton bias PCB 16 pins (AXN316038S + AXN416330S) THIS GOES IN AOH 2 x ICC-AOH 30 pins (AXN330038S + AXN430330S) 2 x ICC-FEH 40 pins (AXN340038S + AXN440330S) 1 x ICC-ICB 50 pins (AXN350038S + AXN450330S) copper: m = 2 x (0.0461 + 0.0515) g + NULL x { 2 x (0.0865 + 0.0965) g } + 2 x (0.1153 + 0.1287) g + 1 x (0.1442 + 0.1609) g = 0.9883 g density = 8.96 g/cm^3 --> volume = 0.110 cm^3 resin: m = 2 x (0.0882 + 0.1085) g + NULL x { 2 x (0.1445 + 0.1547) g } + 2 x (0.1768 + 0.2013) g + 1 x (0.2329 + 0.2764) g = 1.6589 g density (epoxy) = 1.3 g/cm^3 --> volume = 1.276 cm^3 (5) HV stiffener (2 copies) FR4: m = 0.060 g density (T_G10) = 1.90 g/cm^3 --> volume = 0.032 cm^3 (6) ICC SMD Resistors, 28 x (0603) + 2 x (0805) + 4 x (1206) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed m = 0.1090 g density = 3.96525 g/cm^3 --> volume = 0.027 cm^3 (7) ICC SMD Capacitors, 12 x (0805) + 8 x (1812), mostly BaTiO3, the total mass is computed m = 2.020 g density = 6.02 g/cm^3 --> volume = 0.336 cm^3 (8-9) ICC ASICs: 1 x ("CRT245" 24 pin) + 2 x ("LVDSBUF" 16 pin) epoxy: m = ( 1 x 0.015675 + 2 x 0.038519 ) g = 0.092713 g density = 1.3 g/cm^3 --> volume = 0.0713 cm^3 copper: m = [ ( 1 x 0.040 + 2 x 0.076 ) - 0.092713 ) g = 0.099287 g density = 8.96 g/cm^3 --> volume = 0.011 cm^3 (10-13) Hybrid tail (2 copies) see http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf surface: (19 x 30) mm^2 = 570 mm^2 = 5.70 cm^2 - Kapton: (25+25) um = 50 um = 0.0050 cm --> 0.0285 cm^3 - Copper: (18+12+18+18+18+12) um = 96 um = 0.0096 cm --> 0.05472 cm^3 - Solder Mask: 20 um = 0.0020 cm --> 0.0114 cm^3 - Glue: (50+50) um = 100 um thickness = 0.0100 cm --> 0.057 cm^3 (14) HV pin (2 copies) module side: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Kapton_MB.htm m = 0.04 g per module ICB side: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/ICB_MB.htm m = 0.330 g (6 HV wires) --> 0.330 g / 6 = 0.055 per module HV pin (brass CuZn36Pb3 Sn plated): m = ( 0.04 + 0.055 ) g = 0.095 g density (brass) = 8.5 g/cm^3 --> volume = 0.011 cm^3 ....................................................................... # "TOB ICC Layer 3/4 (2 APVs)" "TOB_L34_ICC2" 20.06 80.24 * 1 "PCB board" "T_G10" 4.302 1 ELE * 2 "PCB copper traces" "Copper" 0.180 1 ELE * 3 "NAiS connectors" "Copper" 0.110 1 ELE * 4 "NAiS connectors" "Epoxy" 1.276 1 ELE * 5 "HV Stiffener" "T_G10" 0.032 2 CAB * 6 "ICC Resistors" "Ceramic" 0.027 1 ELE * 7 "ICC Capacitors" "Barium_Titanate" 0.336 1 ELE * 8 "ICC ASICs EMC" "Epoxy" 0.0713 1 ELE * 9 "ICC ASICs copper" "Copper" 0.011 1 ELE * 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 2 ELE * 11 "Hybrid Tail Copper" "Copper" 0.055 2 ELE * 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 2 ELE * 13 "Hybrid Tail Glue" "Epoxy" 0.057 2 ELE * 14 "HV pin (module)" "Brass" 0.011 2 ELE ....................................................................... ======================================================================= Layer 5/6 --------- ICC1 ---- Same as Layer 3/4. (15-16) Laser Diodes (1 additional copy for the L56 AOH, AOHs have only 2 copies) MISSING:m = xxx g density = xxx g/cm^3 --> volume = xxx cm^3 Covers (Al2O3 Aluminiumoxid, ceramic): m = 0.347 g density = 3.96525 g/cm^3 --> volume = 0.0875 cm^3 ....................................................................... # "TOB ICC Layer 5/6 (1 APV)" "TOB_L56_ICC1" 12.98 51.92 * 1 "PCB board" "T_G10" 3.028 1 ELE * 2 "PCB copper traces" "Copper" 0.144 1 ELE * 3 "NAiS connectors" "Copper" 0.0722 1 ELE * 4 "NAiS connectors" "Epoxy" 0.834 1 ELE * 5 "HV Stiffener" "T_G10" 0.032 1 CAB * 6 "ICC Resistors" "Ceramic" 0.019 1 ELE * 7 "ICC Capacitors" "Barium_Titanate" 0.170 1 ELE * 8 "ICC ASICs EMC" "Epoxy" 0.042 1 ELE * 9 "ICC ASICs copper" "Copper" 0.007 1 ELE * 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 1 ELE * 11 "Hybrid Tail Copper" "Copper" 0.055 1 ELE * 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 1 ELE * 13 "Hybrid Tail Glue" "Epoxy" 0.057 1 ELE * 14 "HV pin (module)" "Brass" 0.011 1 ELE * 15 "Laser Diode" "Air" 0.0000 1 ELE * 16 "Laser Cover" "Ceramic" 0.0875 1 ELE ....................................................................... ======================================================================= ICC2 ---- Same as Layer 3/4. (14-15) Laser Diodes (2 additional copies for the L56 AOH, AOHs have only 2 copies) MISSING:m = xxx g density = xxx g/cm^3 --> volume = xxx cm^3 Covers (Al2O3 Aluminiumoxid, ceramic): m = 0.347 g density = 3.96525 g/cm^3 --> volume = 0.0875 cm^3 ....................................................................... # "TOB ICC Layer 5/6 (2 APVs)" "TOB_L56_ICC2" 20.06 80.24 * 1 "PCB board" "T_G10" 4.302 1 ELE * 2 "PCB copper traces" "Copper" 0.180 1 ELE * 3 "NAiS connectors" "Copper" 0.151 1 ELE * 4 "NAiS connectors" "Epoxy" 1.736 1 ELE * 5 "HV Stiffener" "T_G10" 0.032 2 CAB * 6 "ICC Resistors" "Ceramic" 0.027 1 ELE * 7 "ICC Capacitors" "Barium_Titanate" 0.336 1 ELE * 8 "ICC ASICs EMC" "Epoxy" 0.0713 1 ELE * 9 "ICC ASICs copper" "Copper" 0.011 1 ELE * 10 "Hybrid Tail Kapton" "T_Kapton" 0.028 2 ELE * 11 "Hybrid Tail Copper" "Copper" 0.055 2 ELE * 12 "Hybrid Tail Solder Mask" "T_Kapton" 0.011 2 ELE * 13 "Hybrid Tail Glue" "Epoxy" 0.057 2 ELE * 14 "Laser Diode" "Air" 0.0000 2 ELE * 15 "Laser Cover" "Ceramic" 0.0875 2 ELE ....................................................................... ======================================================================= o AOH --- MCVolume: ( 2.3 x 3.0 x 0.2 ) cm^3 = 1.38 cm^3 (1-2) PCBs FR4: m = 0.65 g density (T_G10) = 1.90 g/cm^3 --> volume = 0.342 cm^3 copper: m = 0.497 g density = 8.96 g/cm^3 --> volume = 0.055 cm^3 (3-4) Connectors NaiS socket + header 1 x ICC-AOH 30 pins (AXN330038S + AXN430330S) copper: m = 1 x (0.0865 + 0.0965) g = 0.183 g density = 8.96 g/cm^3 --> volume = 0.020 cm^3 resin: m = 1 x (0.1445 + 0.1547) g = 0.2992 g density (epoxy) = 1.3 g/cm^3 --> volume = 0.230 cm^3 (5) AOH SMD Resistors, 6 x (0603) resistors, mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed m = 0.0127 g density = 3.96525 g/cm^3 --> volume = 0.0032 cm^3 (6) AOH SMD Capacitors, 3 x (0603) + 3 x (0805) mostly BaTiO3, the total mass is computed m = 0.0687 g density = 6.02 g/cm^3 --> volume = 0.0114 cm^3 (7-8) AOH ASICs: 1 x ("LLD" 32 pin) epoxy: m = ( 1 x 0.027098 ) g = 0.027098 g density = 1.3 g/cm^3 --> volume = 0.0208 cm^3 copper: m = [ ( 1 x 0.070 ) - 0.027098 ) ] g = 0.042902 g density = 8.96 g/cm^3 --> volume = 0.0048 cm^3 (9-10) Laser Diodes (2 copies per each AOH + 2 additional copies for the L56 AOH directly in TOB_L56_ICC1/2) MISSING:m = xxx g density = xxx g/cm^3 --> volume = xxx cm^3 Covers (Al2O3 Aluminiumoxid, ceramic): m = 0.347 g density = 3.96525 g/cm^3 --> volume = 0.0875 cm^3 (11) 3D Label Plastic (kapton): m = 0.020 g density = 1.40 g/cm^3 --> volume = 0.0143 cm^3 ....................................................................... # "TOB AOH" "TOB_AOH" 1.38 6.90 * 1 "PCB board" "T_G10" 0.342 1 ELE * 2 "PCB copper traces" "Copper" 0.055 1 ELE * 3 "NAiS connectors" "Copper" 0.020 1 ELE * 4 "NAiS connectors" "Epoxy" 0.230 1 ELE * 5 "AOH Resistors" "Ceramic" 0.0032 1 ELE * 6 "AOH Capacitors" "Barium_Titanate" 0.0114 1 ELE * 7 "AOH ASICs EMC" "Epoxy" 0.0208 1 ELE * 8 "AOH ASICs copper" "Copper" 0.0048 1 ELE * 9 "Laser Diode" "Air" 0.0000 2 ELE * 10 "Laser Cover" "Ceramic" 0.0875 2 ELE * 11 "AOH 3D Label" "T_Kapton" 0.0143 1 ELE ....................................................................... ======================================================================= o TOB_CCUM --------- The TOB CCUM board. Composition taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/CCUM_MB.htm MCVolume: (11.8 x 7.0 x 0.25) cm^3 = 20.65 cm^3 CCUM ----- (1) CCUM FR4 (G10) EDMS Code EDA-00036-V1 m = 13.190 g density = 1.90 g/cm^3 --> volume = 6.942 cm^3 (2) CCUM copper traces EDMS Code EDA-00036-V1 m = 2.787 g density = 8.96 g/cm^3 --> volume = 0.311 cm^3 (3-4) CCUM NAiS connector EDMS Code EDA-00036-V1, details from http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/Connectors_MB.htm socket + header CCUM-ICB 80 pins (AXN350038S + AXN480330S) copper: m = (0.2306 + 0.2574) g = 0.488 g density = 8.96 g/cm^3 --> volume = 0.054 cm^3 resin: m = (0.337 + 0.3882) g = 0.7259 g density (epoxy) = 1.3 g/cm^3 --> volume = 0.558 cm^3 (5) CCUM SMD Resistors EDMS Code EDA-00036-V1, 28 x (0603), mostly Al2O3 (Aluminiumoxid, ceramic), the total mass is computed m = 0.060 g density = 3.96525 g/cm^3 --> volume = 0.015 cm^3 (6) CCUM SMD Capacitors EDMS Code EDA-00036-V1, 20 x (0805) + 3 x (1210), mostly BaTiO3, the total mass is computed m = 0.570 g density = 6.02 g/cm^3 --> volume = 0.095 cm^3 (7-9) CCUM ASICs EDMS Code EDA-00036-V1 IC "CCU" 196 pin BGA196 (Ball Grid Array), Sn/Pb/Ag 62/36/2: m = 0.1131 g density = 8.82 g/cm^3 --> volume = 0.013 cm^3 epoxy: m = 0.4269 g density = 1.3 g/cm^3 volume = 0.328 cm^3 copper: m = (0.678 - 0.1131 - 0.4269) g = 0.138 g density = 8.96 g/cm^3 --> volume = 0.015 cm^3 (10) Other components: araldite glue (take epoxy): 1/2 CCUM, (1/4 SCLAC), (1/4 SCACC) m = 1.05 g / 2 = 0.525 g density = 1.3 g/cm^3 volume = 0.404 cm^3 The wires are in TOB_Conn[12/34/56] ............................................................................ # "TOB CCUM board" "TOB_CCUM" 20.65 82.6 * 1 "CCUM board" "T_G10" 6.942 1 ELE * 2 "CCUM copper traces" "Copper" 0.311 1 ELE * 3 "CCUM-ICB NAiS connector" "Copper" 0.054 1 ELE * 4 "CCUM-ICB NAiS connector" "Epoxy" 0.558 1 ELE * 5 "CCUM Resistors" "Ceramic" 0.015 1 ELE * 6 "CCUM Capacitors" "Barium_Titanate" 0.095 1 ELE * 7 "CCUM ASICs BGA" "BGA" 0.013 1 ELE * 8 "CCUM ASICs EMC" "Epoxy" 0.328 1 ELE * 9 "CCUM ASICs copper" "Copper" 0.015 1 ELE * 10 "CCUM glue" "Epoxy" 0.404 1 ELE ............................................................................ ============================================================================ o TOB Rod Connectors (inside) --------------------------- MCVolume: (11.800 x 7.500 x 0.500) cm^3 = 44.25 cm^3 All the TOB Connectors are the same (Layers 12/34/56) except the optical part. Layer 1/2 ---------- As Layer 3/4, except optical components. Optical components ------------------ Different for different layers (22-24) Optical fibers masses are per AOH, multiplicity will be given by the number of AOHs AOH x ( #fibers x type ) x length_fraction length_fraction: (total_length-5) cm per each fiber is in TOB_optfib_L12 2 x ( TOB_2_088 ) x 5/88 = 2 x 2 x 88 cm x 5/88 = 20 cm 2 x ( TOB_2_070 ) x 5/70 = 2 x 2 x 70 cm x 5/70 = 20 cm 4 x ( TOB_2_056 ) x 5/56 = 4 x 2 x 56 cm x 5/56 = 40 cm 4 x ( TOB_2_035 ) x 5/35 = 4 x 2 x 35 c mx 5/35 = 40 cm Total optical fibers length: 120 cm All here: 3D label tags (kapton): m = [ (2 x 2) + (2 x 2) + (4 x 2) + (4 x 2) ] x 0.110 g = 24 x 0.110 g = 2.64 g density = 1.40 g/cm^3 --> volume = 1.714 cm^3 MU connectors (kapton): m = [ (2 x 2) + (2 x 2) + (4 x 2) + (4 x 2) ] x 0.822 g = 24 x 0.822 g = 19.728 g density = 1.40 g/cm^3 --> volume = 14.091 cm^3 (25) Ribbon connectors (2 copies) (26) Ruggedized ribbon: total length 80 mm ..................................................................................... # "TOB Rod Connections Layer 1/2" "TOB_CONN12" 44.25 88.5 * 1 "SCLAC board" "T_G10" 0.211 1 ELE * 2 "SCLAC copper traces" "Copper" 0.007 1 ELE * 3 "CCUM wires Cu" "Copper" 0.191 2 CAB * 4 "CCUM wires Al" "Aluminium" 0.123 2 CAB * 5 "CCUM wires PEI" "Silicone_Gel" 0.203 2 CAB * 6 "CCUM wires SILTEM" "Polyethylene" 0.788 2 CAB * 7 "BUS wires Cu" "Copper" 0.740 1 CAB * 8 "BUS wires Al" "Aluminium" 0.0877 1 CAB * 9 "BUS wires PEI" "Silicone_Gel" 0.144 1 CAB * 10 "BUS wires SILTEM" "Polyethylene" 2.365 1 CAB * 11 "SCLAC glue" "Epoxy" 0.202 1 SUP * 12 "Output cable Shield" "Aluminium" 0.089 1 CAB * 13 "Output cable Sleeve" "Polyethylene" 0.642 1 CAB * 14 "Input and Output cable Tie" "T_Kapton" 0.195 1 CAB * 15 "Input and Output cable Solder Paste" "BGA" 0.038 1 CAB * 16 "ICB,LVLAC,HVLAC glue" "Epoxy" 0.181 1 SUP * 17 "ICB Solder Paste" "BGA" 0.005 1 CAB * 18 "LVLAC substrate" "T_G10" 0.242 1 ELE * 19 "LVLAC copper traces" "Copper" 0.0126 1 ELE * 20 "HVLAC substrate" "T_G10" 0.174 1 ELE * 21 "HVLAC copper traces" "Copper" 0.0036 1 ELE * 22 "Optical fibers" "Optical_Fiber" 6.362E-3 120 CAB * 23 "Optical fibers 3D label tag" "T_Kapton" 1.714 1 CAB * 24 "Optical fibers MU connectors" "T_Kapton" 14.091 1 CAB * 25 "Ribbon Connectors" "T_Ribbon12xMUConn" 12.0 2 CAB * 26 "Ruggedized ribbons" "T_RuggRibbon" 0.086 8 CAB ..................................................................................... ===================================================================================== Layer 3/4 ---------- SCLAC ----- Ladder Adapter Card Composition taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/CCUM_MB.htm EDMS Code EP 680-1174-510 (1) SCLAC FR4 m = 0.400 g density = 1.90 g/cm^3 --> volume = 0.211 cm^3 (2) SCLAC copper traces m = 0.061 g density = 8.96 g/cm^3 --> volume = 0.007 cm^3 Wires ----- Short tail (to be multiplied by 2, the difference 'long tail'-1x'short tail' will be included outside) (3-6) - Connected to CCUM Shielded Twisted pair (112 mm), 9 pairs, total mass of a single wire (number of components to be multiplied by 2) + shielded twisted pair + 0.5 mm^2 Copper wire, 2 pieces 106 mm 1 piece 100 mm. Tinned copper wire 100% outside the rod. total mass; 2 copies in the mixture Copper: m = ( 0.3417 + 0.9328 + 0.4400 ) g = 1.7145 g density = 8.96 g/cm^3 --> volume = 0.191 cm^3 Aluminium: m = ( 0.3326 + 0 + 0 ) = 0.3326 g density = 2.7 g/cm^3 --> volume = 0.123 cm^3 PEI: m = ( 0.1956 + 0 + 0 ) = 0.1956 g density (silicone gel) = 0.965 g/cm^3 --> volume = 0.203 cm^3 SILTEM: m = ( 0 + 0.5088 + 0.240 ) g = 0.7488 g density (polyethylene) = 0.95 g/cm^3 --> volume = 0.788 cm^3 (7-10) - Connected to BUS Shielded Twisted pair (112 mm), 4 pieces + Shielded Twisted pair (135 mm), 2 pieces + 1.0 mm^2 Copper wire, 4 pieces 112 mm + 0.5 mm^2 Copper wire, 1 piece 112 mm, 1 piece 147 mm, 1 piece 149 mm + 1.0 mm^2 Copper wire, 1 piece 290 mm, only 80 mm here, the rest outside the rod total mass; 1 only copy in the mixture Copper: m = ( 0.1519 + 0.0915 + 3.8976 + 0.4928 + 0.6468 + 0.6556 + 80/290 x 2.5230 ) g = 6.6322 g density = 8.96 g/cm^3 --> volume = 0.740 cm^3 Aluminium: m = ( 0.1478 + 0.0891 + 0 + 0 + 0 + 0 + 80/290 x 0 ) = 0.2369 g density = 2.7 g/cm^3 --> volume = 0.0877 cm^3 PEI: m = ( 0.0869 + 0.0524 + 0 + 0 + 0 + 0 + 80/290 x 0 ) = 0.1393 g density (silicone gel) = 0.965 g/cm^3 --> volume = 0.144 cm^3 SILTEM: m = ( 0 + 0 + 1.0752 + 0.2688 + 0.3528 + 0.3576 + 80/290 x 0.6960 ) g = 2.2464 g density (polyethylene) = 0.95 g/cm^3 --> volume = 2.365 cm^3 Other components ---------------- (11) Araldite glue (take epoxy): (1/2 CCUM), 1/4 SCLAC, (1/4 SCACC) m = 1.05 g / 4 = 0.2625 g density = 1.3 g/cm^3 volume = 0.202 cm^3 (12) Output cable shield Aluminium: 1/2 here, (1/2 outside) m = 0.480 g / 2 = 0.240 g density = 2.7 g/cm^3 volume = 0.089 cm^3 (13) Output cable sleeve (l=55 mm, ext diameter=9.5 mm, 1 piece) + (l=10 mm, ext diameter=3.0 mm, 4 pieces) Polyolefin (take polyethylene): total mass, 1/2 here, (1/2 outside) m = ( 0.90 + 0.32 ) g / 2 = 0.61 g density = 0.95 g/cm^3 volume = 0.642 cm^3 (14) Input & Output cable tie Kapton: 2/3 here, (1/3 outside) m = 0.41 g * (2/3) = 0.273 g density = 1.40 g/cm^3 volume = 0.195 cm^3 (15) Input & Output cable solder paste (BGA): 1/2 here, (1/2 outside) m = 0.67 g / 2 = 0.335 g density = 8.82 g/cm^3 volume = 0.038 cm^3 (16) ICB Araldite glue (take epoxy): 1/2 CONN, (1/2 ICB) m = 0.47 g / 2 = 0.235 g density = 1.3 g/cm^3 volume = 0.181 cm^3 (17) ICB Solder paste (BGA): (1/2 ICB), 1/2 CONN m = 0.09 g / 2 = 0.045 g density = 8.82 g/cm^3 volume = 0.005 cm^3 LVLAC ----- (18-19) LVLAC From the ICB FR4: m = 0.46 g density (T_G10) = 1.90 g/cm^3 --> volume = 0.242 cm^3 Copper: m = 0.113 g density = 8.96 g/cm^3 --> volume = 0.0126 cm^3 HVLAC ----- (20-21) HVLAC From the ICB FR4: m = 0.33 g density (T_G10) = 1.90 g/cm^3 --> volume = 0.174 cm^3 Copper: m = 0.032 g density = 8.96 g/cm^3 --> volume = 0.0036 cm^3 SCCAC ----- Slow Control Cable Adapter Card Composition taken from G.Magazzù measurements: http://test-gmagazzu.web.cern.ch/test%2Dgmagazzu/TOB/MB/CCUM_MB.htm 2 x short tail It will go 100% outside Optical components ------------------ Different for different layers (22-24) Optical fibers masses are per AOH, multiplicity will be given by the number of AOHs AOH x ( #fibers x type ) x length_fraction length_fraction: (total_length-5) cm per each fiber is in TOB_optfib_L34 1 x ( TOB_2_088 ) x 5/88 = 1 x 2 x 88 cm x 5/88 = 10 cm 1 x ( TOB_2_070 ) x 5/70 = 1 x 2 x 70 cm x 5/70 = 10 cm 2 x ( TOB_2_056 ) x 5/56 = 2 x 2 x 56 cm x 5/56 = 20 cm 2 x ( TOB_2_035 ) x 5/35 = 2 x 2 x 35 c mx 5/35 = 20 cm Total optical fibers length: 60 cm All here: 3D label tags (kapton): m = [ (1 x 2) + (1 x 2) + (2 x 2) + (2 x 2) ] x 0.110 g = 12 x 0.110 g = 1.32 g density = 1.40 g/cm^3 --> volume = 0.943 cm^3 MU connectors (kapton): m = [ (1 x 2) + (1 x 2) + (2 x 2) + (2 x 2) ] x 0.822 g = 12 x 0.822 g = 9.864 g density = 1.40 g/cm^3 --> volume = 7.046 cm^3 (25) Ribbon connectors (1 copy) (26) Ruggedized ribbon: total length 40 mm ..................................................................................... # "TOB Rod Connections Layer 3/4" "TOB_CONN34" 44.25 88.5 * 1 "SCLAC board" "T_G10" 0.211 1 ELE * 2 "SCLAC copper traces" "Copper" 0.007 1 ELE * 3 "CCUM wires Cu" "Copper" 0.191 2 CAB * 4 "CCUM wires Al" "Aluminium" 0.123 2 CAB * 5 "CCUM wires PEI" "Silicone_Gel" 0.203 2 CAB * 6 "CCUM wires SILTEM" "Polyethylene" 0.788 2 CAB * 7 "BUS wires Cu" "Copper" 0.740 1 CAB * 8 "BUS wires Al" "Aluminium" 0.0877 1 CAB * 9 "BUS wires PEI" "Silicone_Gel" 0.144 1 CAB * 10 "BUS wires SILTEM" "Polyethylene" 2.365 1 CAB * 11 "SCLAC glue" "Epoxy" 0.202 1 SUP * 12 "Output cable Shield" "Aluminium" 0.089 1 CAB * 13 "Output cable Sleeve" "Polyethylene" 0.642 1 CAB * 14 "Input and Output cable Tie" "T_Kapton" 0.195 1 CAB * 15 "Input and Output cable Solder Paste" "BGA" 0.038 1 CAB * 16 "ICB,LVLAC,HVLAC glue" "Epoxy" 0.181 1 SUP * 17 "ICB Solder Paste" "BGA" 0.005 1 CAB * 18 "LVLAC substrate" "T_G10" 0.242 1 ELE * 19 "LVLAC copper traces" "Copper" 0.0126 1 ELE * 20 "HVLAC substrate" "T_G10" 0.174 1 ELE * 21 "HVLAC copper traces" "Copper" 0.0036 1 ELE * 22 "Optical fibers" "Optical_Fiber" 6.362E-3 60 CAB * 23 "Optical fibers 3D label tag" "T_Kapton" 0.943 1 CAB * 24 "Optical fibers MU connectors" "T_Kapton" 7.046 1 CAB * 25 "Ribbon Connectors" "T_Ribbon12xMUConn" 12.0 1 CAB * 26 "Ruggedized ribbons" "T_RuggRibbon" 0.086 4 CAB ..................................................................................... ===================================================================================== Layer 5/6 ---------- As Layer 3/4, except optical components. Optical components ------------------ Different for different layers (22-24) Optical fibers masses are per AOH, multiplicity will be given by the number of AOHs AOH x ( #fibers x type ) x length_fraction length_fraction: (total_length-5) cm per each fiber is in TOB_optfib_L56 1 x ( TOB_3_088 ) x 5/88 = 1 x 3 x 88 cm x 5/88 = 15 cm 1 x ( TOB_3_070 ) x 5/70 = 1 x 3 x 70 cm x 5/70 = 15 cm 2 x ( TOB_3_056 ) x 5/56 = 2 x 3 x 56 cm x 5/56 = 30 cm 2 x ( TOB_3_035 ) x 5/35 = 2 x 3 x 35 c mx 5/35 = 30 cm Total optical fibers length: 90 cm All here: 3D label tags (kapton): m = [ (1 x 3) + (1 x 3) + (2 x 3) + (2 x 3) ] x 0.110 g = 18 x 0.110 g = 1.98 g density = 1.40 g/cm^3 --> volume = 1.414 cm^3 MU connectors (kapton): m = [ (1 x 3) + (1 x 3) + (2 x 3) + (2 x 3) ] x 0.822 g = 18 x 0.822 g = 14.796 g density = 1.40 g/cm^3 --> volume = 10.569 cm^3 (25) Ribbon connectors (2 copies) (26) Ruggedized ribbon: total length 60 mm ..................................................................................... # "TOB Rod Connections Layer 5/6" "TOB_CONN56" 44.25 88.5 * 1 "SCLAC board" "T_G10" 0.211 1 ELE * 2 "SCLAC copper traces" "Copper" 0.007 1 ELE * 3 "CCUM wires Cu" "Copper" 0.191 2 CAB * 4 "CCUM wires Al" "Aluminium" 0.123 2 CAB * 5 "CCUM wires PEI" "Silicone_Gel" 0.203 2 CAB * 6 "CCUM wires SILTEM" "Polyethylene" 0.788 2 CAB * 7 "BUS wires Cu" "Copper" 0.740 1 CAB * 8 "BUS wires Al" "Aluminium" 0.0877 1 CAB * 9 "BUS wires PEI" "Silicone_Gel" 0.144 1 CAB * 10 "BUS wires SILTEM" "Polyethylene" 2.365 1 CAB * 11 "SCLAC glue" "Epoxy" 0.202 1 SUP * 12 "Output cable Shield" "Aluminium" 0.089 1 CAB * 13 "Output cable Sleeve" "Polyethylene" 0.642 1 CAB * 14 "Input and Output cable Tie" "T_Kapton" 0.195 1 CAB * 15 "Input and Output cable Solder Paste" "BGA" 0.038 1 CAB * 16 "ICB,LVLAC,HVLAC glue" "Epoxy" 0.181 1 SUP * 17 "ICB Solder Paste" "BGA" 0.005 1 CAB * 18 "LVLAC substrate" "T_G10" 0.242 1 ELE * 19 "LVLAC copper traces" "Copper" 0.0126 1 ELE * 20 "HVLAC substrate" "T_G10" 0.174 1 ELE * 21 "HVLAC copper traces" "Copper" 0.0036 1 ELE * 22 "Optical fibers" "Optical_Fiber" 6.362E-3 90 CAB * 23 "Optical fibers 3D label tag" "T_Kapton" 1.414 1 CAB * 24 "Optical fibers MU connectors" "T_Kapton" 10.569 1 CAB * 25 "Ribbon Connectors" "T_Ribbon12xMUConn" 12.0 2 CAB * 26 "Ruggedized ribbons" "T_RuggRibbon" 0.086 6 CAB ..................................................................................... ===================================================================================== # "END" "END" 0. 0. this has to be the last line ! [WAS o Aluminium cooling IV -------------------- Al and locator piece at hybrid sides No screw ! MCVolume: 1.5 x 2.8 x 0.03 cm (1) Al heat spreader dimensions from EDM file CMSTKOBM0024 version 0 { [ 15 x 28 ] - (8 x 8 / 2) - [ pi x (2/2)^2 ] } mm^2 x 0.300 mm = 384.8584 mm^2 x 0.300 mm = 115.4575 mm^3 [WAS 0.116 cm^3] [THIS MATERIAL HAS BEEN CREATED APART (2) CF compensator dimensions from EDM file CMSTKOBM0035 version AA { [ 16 x 26 ] - [ pi x (10 / 2)^2 ] } mm^2 x 0.300 mm = = 337.46 mm^2 x 0.300 mm = 101.238 mm^3 [WAS 0.15 cm^3] ] (2) CuBe/brass -> take all Cu for now: 0.0044 cm^3 x 3 .................................................................. # "TOB Module Cooling 4" "TOB_mod_cool4" 0.126 4.2 * 1 "Al heat spreader" "Aluminium" 0.115475 1 COL * 2 "Cu locator" "Copper" 0.0044 3 SUP .................................................................. ================================================================== NO MORE NEEDED, ALL THE SPREADER ARE THE SAME ] [WAS: o TOB_CCUM --------- Not much know at this stage, so here comes some SciFi ! MCVolume: 11.8 x 7 x 0.25 cm Take the proposal from Marchioro with 3 instead of 2 connectors ! G10 32 x 32 x 1 mm -> 1.02 cm^3 4 layer Cu 17 um, 50 % occ CCU in plastic housing, 15 x 15 x 1mm 196 solder "balls" diameter 0.5 mm 2 more plastic ship carriers, 7 x 7 x 0.3 mm 4 caps, half size of 0402 8 R " For connectors: take Robert's proposal NAIS 80 pin connector. ...................................................................... "TOB CCUM board" "TOB_CCUM" 20.65 82.6 1 "CCUM board" "G10" 1.02 1 ELE 2 "Copper traces" "Copper" 0.035 1 ELE 3 "CCU in housing" "T_Kapton" 0.225 1 ELE 4 "Solder balls" "SMD_metal" 0.01 1 ELE 5 "Other chips" "T_Kapton" 0.015 2 ELE 6 "Capacitors" "Alumina" 1.E-4 4 ELE 7 "Resistors" "Carbon" 1.E-4 8 ELE 8 "Solder" "SMD_metal" 1.E-4 12 ELE 9 "Connector" "T_Kapton" 9.107E-3 80 ELE 10 "Connector pins" "Copper" 8.092E-4 80 ELE ..................................................................... ===================================================================== ] [WAS: o TOB Electronics ICC1/2 ----------------------- Need 6 different mixtures here ! Don't know about cooling !! Left out for the moment $$ Per ICC: (1) CF support piece: 12.5 x 3 x 0.09 cm (2-3) ICC1 card: 11.8 x 4.4 - 2*0.25*2 = 50.92 cm^2 x 0.1 cm = 5.09 cm^3 G10 Cu : 4 layers a 25 um, 50 % occ => 0.26 cm^3 ICC2 card: 11.8 x 6.8 - 2*0.25*2 = 79.24 cm^2 x 0.1 cm = 7.92 cm^3 G10 Cu : 0.4 cm^3 (4-5) Connector pairs: all NAIS per pin : Plastic: 0.01275 g -> 9.107E-3 cm^3 Kapton Cu : 7.25E-3 g -> 8.092E-4 cm^3 Cu Pins: 50 + (40+16+30)*OH (6-10) Optohybrid: dimensions: 23 x 30 mm, 0.5 mm thick FR4 For the rest: take information from TIB OH !! Cu : 4 layers 50 % occ, 35 um Laser driver: 0.0025 cm^3 Si (1/OH) Laser diode: 0.02 cm^3 Si (1 for 2 APVs) Fiber clamps: 1.4 x 0.3 x 0.15 cm Kapton (1/OH) Additional components: Kapton from hybrid to ICC: 4 x 3 x 0.01 cm -> 0.12 cm^3 Cu: 2 layers 50 um 50 % occ -> 0.06 cm^3 Buffers on ICC & ICB: 0.02 cm^3 Kapton, 3.1E-3 Cu 1 + 1*OH Capacitors large 4x7x2 mm = 0.056 cm^3 2+3*OH Capacitors (0805) 2x1.25x1.25 = 3.1E-3 cm^3 19*OH+3 Resistors (0603) 1.15E-3 cm^3 12.5*OH+3 Solder: 1.E-3*(large caps) + 2.E-4*(small caps+R) Layer 5/6 ICC1 (serves 1 double sided module) => 2 Optohybrids 2 Kapton pigtails, 3 buffers 8 large caps, 41 small caps, 28 R's ................................................................. "TOB electronics lay 5/6 ICC1" "TOB_ICC1" 25.96 51.92 1 "CF support" "Carbon fibre str." 3.375 1 SUP 2 "ICC card" "G10" 5.09 1 ELE 3 "ICC traces" "Copper" 0.254 1 ELE 4 "Connectors" "T_Kapton" 9.107E-3 222 ELE 5 "Connectors pins" "Copper" 8.092E-4 222 ELE 6 "Optohybrid" "T_FR4" 0.345 2 ELE 7 "Optohybrid traces" "Copper" 0.048 2 ELE 8 "Laser drivers" "Silicon" 0.0025 2 ELE 9 "Laser diode" "Silicon" 0.02 4 ELE 10 "Fiber clamp" "T_Kapton" 0.063 2 ELE 11 "Pigtail and buffers" "T_Kapton" 0.3 1 ELE 12 "Pigtail and buffers" "Copper" 0.129 1 ELE 13 "Capacitors" "Alumina" 0.5751 1 ELE 14 "Resistors" "Carbon" 1.15E-3 28 ELE 15 "Solder" "SMD_metal" 0.022 1 ELE ................................................................ Layer 5/6 ICC2 (serves 2 double sided module) => 4 Optohybrids 4 Kapton pigtails, 5 buffers 14 large caps, 79 small caps, 53 R's ................................................................. "TOB electronics lay 5/6 ICC2" "TOB_ICC2" 40.12 80.24 1 "CF support" "Carbon fibre str." 3.375 1 SUP 2 "ICC card" "G10" 7.92 1 ELE 3 "ICC traces" "Copper" 0.4 1 ELE 4 "Connectors" "T_Kapton" 9.107E-3 394 ELE 5 "Connectors pins" "Copper" 8.092E-4 394 ELE 6 "Optohybrid G10" "T_FR4" 0.345 4 ELE 7 "Optohybrid traces" "Copper" 0.048 4 ELE 8 "Laser drivers" "Silicon" 0.0025 4 ELE 9 "Laser diode" "Silicon" 0.02 8 ELE 10 "Fiber clamp" "T_Kapton" 0.063 4 ELE 11 "Pigtail and buffers" "T_Kapton" 0.58 1 ELE 12 "Pigtail and buffers" "Copper" 0.256 1 ELE 13 "Capacitors" "Alumina" 1.029 1 ELE 14 "Resistors" "Carbon" 1.15E-3 53 ELE 15 "Solder" "SMD_metal" 0.04 1 ELE ................................................................. Layer 7/8 ICC1 (serves 1 single sided module with 4 APVs) => 1 Optohybrids 1 Kapton pigtails, 2 buffers 5 large caps, 22 small caps, 16 R's ................................................................. "TOB electronics lay 7/8 ICC1" "TOB_ICC3" 25.96 51.92 1 "CF support" "Carbon fibre str." 3.375 1 SUP 2 "ICC card" "G10" 5.09 1 ELE 3 "ICC traces" "Copper" 0.254 1 ELE 4 "Connectors" "T_Kapton" 9.107E-3 136 ELE 5 "Connectors pins" "Copper" 8.092E-4 136 ELE 6 "Optohybrid" "T_FR4" 0.345 1 ELE 7 "Optohybrid traces" "Copper" 0.048 1 ELE 8 "Laser drivers" "Silicon" 0.0025 1 ELE 9 "Laser diode" "Silicon" 0.02 2 ELE 10 "Fiber clamp" "T_Kapton" 0.063 1 ELE 11 "Pigtail and buffers" "T_Kapton" 0.16 1 ELE 12 "Pigtail and buffers" "Copper" 0.0662 1 ELE 13 "Capacitors" "Alumina" 0.348 1 ELE 14 "Resistors" "Carbon" 1.15E-3 16 ELE 15 "Solder" "SMD_metal" 0.0126 1 ELE ................................................................. Layer 7/8 ICC2 (serves 2 single sided module with 4 APVs) => 2 Optohybrids 2 Kapton pigtails, 3 buffers 8 large caps, 41 small caps, 28 R's ................................................................. "TOB electronics lay 7/8 ICC2" "TOB_ICC4" 40.12 80.24 1 "CF support" "Carbon fibre str." 3.375 1 SUP 2 "ICC card" "G10" 7.92 1 ELE 3 "ICC traces" "Copper" 0.4 1 ELE 4 "Connectors" "T_Kapton" 9.107E-3 222 ELE 5 "Connectors pins" "Copper" 8.092E-4 222 ELE 6 "Optohybrid" "T_FR4" 0.345 2 ELE 7 "Optohybrid traces" "Copper" 0.048 2 ELE 8 "Laser drivers" "Silicon" 0.0025 2 ELE 9 "Laser diode" "Silicon" 0.02 4 ELE 10 "Fiber clamp" "T_Kapton" 0.063 2 ELE 11 "Pigtail and buffers" "T_Kapton" 0.3 1 ELE 12 "Pigtail and buffers" "Copper" 0.129 1 ELE 13 "Capacitors" "Alumina" 0.5751 1 ELE 14 "Resistors" "Carbon" 1.15E-3 28 ELE 15 "Solder" "SMD_metal" 0.022 1 ELE ................................................................. Layer 9/10 ICC1 (serves 1 single sided module with 6 APVs) => 1 Optohybrids 1 Kapton pigtails, 2 buffers 5 large caps, 22 small caps, 16 R's ................................................................. "TOB electronics lay 9/10 ICC1" "TOB_ICC5" 25.96 51.92 1 "CF support" "Carbon fibre str." 3.375 1 SUP 2 "ICC card" "G10" 5.09 1 ELE 3 "ICC traces" "Copper" 0.254 1 ELE 4 "Connectors" "T_Kapton" 9.107E-3 136 ELE 5 "Connectors pins" "Copper" 8.092E-4 136 ELE 6 "Optohybrid" "T_FR4" 0.345 1 ELE 7 "Optohybrid traces" "Copper" 0.048 1 ELE 8 "Laser drivers" "Silicon" 0.0025 1 ELE 9 "Laser diode" "Silicon" 0.02 3 ELE 10 "Fiber clamp" "T_Kapton" 0.063 1 ELE 11 "Pigtail and buffers" "T_Kapton" 0.16 1 ELE 12 "Pigtail and buffers" "Copper" 0.0662 1 ELE 13 "Capacitors" "Alumina" 0.348 1 ELE 14 "Resistors" "Carbon" 1.15E-3 16 ELE 15 "Solder" "SMD_metal" 0.0126 1 ELE ................................................................. Layer 9/10 ICC2 (serves 2 single sided module with 6 APVs) => 2 Optohybrids 2 Kapton pigtails, 3 buffers 8 large caps, 41 small caps, 28 R's ................................................................. "TOB electronics lay 9/10 ICC2" "TOB_ICC6" 40.12 80.24 1 "CF support" "Carbon fibre str." 3.375 1 SUP 2 "ICC card" "G10" 7.92 1 ELE 3 "ICC traces" "Copper" 0.4 1 ELE 4 "Connectors" "T_Kapton" 9.107E-3 222 ELE 5 "Connectors pins" "Copper" 8.092E-4 222 ELE 6 "Optohybrid" "T_FR4" 0.345 2 ELE 7 "Optohybrid traces" "Copper" 0.048 2 ELE 8 "Laser drivers" "Silicon" 0.0025 2 ELE 9 "Laser diode" "Silicon" 0.02 6 ELE 10 "Fiber clamp" "T_Kapton" 0.063 2 ELE 11 "Pigtail and buffers" "T_Kapton" 0.3 1 ELE 12 "Pigtail and buffers" "Copper" 0.129 1 ELE 13 "Capacitors" "Alumina" 0.5751 1 ELE 14 "Resistors" "Carbon" 1.15E-3 28 ELE 15 "Solder" "SMD_metal" 0.022 1 ELE ................................................................. ================================================================= ] [WAS: o TOB rod connectors (inside) --------------------------- MCVolume 11.8 x 7.5 x 0.5 cm (1) CF support plate: 12.5 x 12.5 x 0.09 cm = 14.06 cm^3 (2) Loose wires (Robert) Al xsection 1 mm^2 For control: 10 cables with l=22cm, 10 with l=12 cm LV : 8 " l=12 cm Forget about the Polyethylene shielding, absorbed in optical connector uncertainty ! (3) Optical connectors: 2 for layer 5/6, 1 for 7-10 Info from Francois: 46.8 g Plastic, 8.4 g Cu OVERESTIMATE, don't believe ! take 15 cm^3 plastic ..................................................................... "TOB rod connections 5/6" "TOB_CONN1" 44.25 88.5 1 "Support plate" "Carbon fibre str." 14.06 1 SUP 2 "Al wires" "Aluminium" 0.12 37 CAB 3 "Optoconnector" "T_Kapton" 15.0 2 CAB 4 "Optoconnector" "Copper" 0.446 2 CAB .................................................................... .................................................................... "TOB rod connections 7-10" "TOB_CONN2/3" 44.25 88.5 1 "Support plate" "Carbon fibre str." 14.06 1 SUP 2 "Al wires" "Aluminium" 0.12 37 CAB 3 "Optoconnector" "T_Kapton" 15.0 1 CAB 4 "Optoconnector" "Copper" 0.446 1 CAB .................................................................... ==================================================================== ]